Beijing plans 12-inch wafer fab, pouring US$4.6 billion into new chip project 2024-11-16T08:30:17-05:00November 16th, 2024| share this article![#item_full_content] Read More share this article! Related Posts 2024 FBS Summit: Hong Kong event gathers family business owners November 16th, 2024 Hong Kong financial sector downsizing rekindles flexible office market November 16th, 2024 Tokyo Disney’s hometown eyes lodging tax to ease local burdens November 16th, 2024 There is a mismatch in expectations Vs reality in impact investments: Schneider November 16th, 2024
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